DocumentCode
315443
Title
Highly Reliable Packaging Structure For LiNBO/sub3/ Optical Modulators For High-speed Communication Systems
Author
Mitsugi, Naoki ; Nagata, Hirotoshi ; Minowa, Junichiro
fYear
1997
fDate
16-18 April 1997
Firstpage
18
Lastpage
21
Keywords
Bonding; High speed optical techniques; Optical fiber communication; Optical fiber devices; Optical fiber polarization; Optical fibers; Optical materials; Optical modulation; Packaging; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618970
Link To Document