DocumentCode :
315446
Title :
Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip
Author :
Lau, John H.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
32
Lastpage :
36
Keywords :
Application specific integrated circuits; Cache memory; Chip scale packaging; Consumer electronics; Control systems; Electronics packaging; Flip chip; Integrated circuit packaging; Microprocessors; Packaging machines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618973
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315446
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