• DocumentCode
    315446
  • Title

    Electronics Packaging Technology Update: BGA, CSP, DCA, And Flip Chip

  • Author

    Lau, John H.

  • fYear
    1997
  • fDate
    16-18 April 1997
  • Firstpage
    32
  • Lastpage
    36
  • Keywords
    Application specific integrated circuits; Cache memory; Chip scale packaging; Consumer electronics; Control systems; Electronics packaging; Flip chip; Integrated circuit packaging; Microprocessors; Packaging machines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
  • Conference_Location
    IEEE
  • Print_ISBN
    0-7803-4235-6
  • Type

    conf

  • Filename
    618973
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=315446