DocumentCode :
315449
Title :
Evolution And Revolution In Electronic Packaging And Interconnection; An Historical View Of The Future
Author :
Bauer, Charles E., Jr.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
47
Lastpage :
50
Keywords :
Aerospace electronics; Aerospace industry; Assembly systems; Costs; Electronics industry; Electronics packaging; Government; Manufacturing; North America; Research and development;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618976
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315449
