DocumentCode
315449
Title
Evolution And Revolution In Electronic Packaging And Interconnection; An Historical View Of The Future
Author
Bauer, Charles E., Jr.
fYear
1997
fDate
16-18 April 1997
Firstpage
47
Lastpage
50
Keywords
Aerospace electronics; Aerospace industry; Assembly systems; Costs; Electronics industry; Electronics packaging; Government; Manufacturing; North America; Research and development;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618976
Link To Document