DocumentCode
315451
Title
New Flip Chip Bonding Technique Using Transferred Micro Solder Bumps
Author
Tsunetsugu, Hideki ; Hayashi, Tsuyoshi ; Hosoya, Masakaze ; Katsura, Kohsuke
fYear
1997
fDate
16-18 April 1997
Firstpage
56
Lastpage
61
Keywords
Bonding; Closed loop systems; Flip chip; Optical fiber communication; Optical interconnections; Optical materials; Photodiodes; Preamplifiers; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618978
Link To Document