DocumentCode :
315452
Title :
The Application Of Flip Chip Bonding Technology To The Mobile Communications Terminals
Author :
Takizawa, Minoru ; Toni, Akiko
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
62
Lastpage :
66
Keywords :
Bonding forces; Flip chip; Gold; Mobile communication; Plastic integrated circuit packaging; Reflow soldering; Semiconductor device measurement; Surface-mount technology; Temperature distribution; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618979
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315452
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