• DocumentCode
    315453
  • Title

    A New Built-up Epoxy Resin Pcb Technology For High Density Surface Mount Package And Device Attachment

  • Author

    Harazono, Masaaki ; lwata, Y. ; Takami, Seiichi

  • fYear
    1997
  • fDate
    16-18 April 1997
  • Firstpage
    82
  • Lastpage
    85
  • Keywords
    Conducting materials; Copper; Epoxy resins; Insulation; Nonhomogeneous media; Packaging; Printed circuits; Space technology; Surface-mount technology; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
  • Conference_Location
    IEEE
  • Print_ISBN
    0-7803-4235-6
  • Type

    conf

  • Filename
    618983
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=315453