مرکز منطقه ای اطلاع رساني علوم و فناوري - Micro-ball Bump Technology For Fine-pitch Interconnections

DocumentCode :

315456

Title :

Micro-ball Bump Technology For Fine-pitch Interconnections

Author :

Shimokawa, Kenji ; Tatsumi, Kohei ; Hashino, Eiji ; Ohzeki, Yoshio ; Konda, Masashi ; Kawakami, Youji

fYear :

1997

fDate :

16-18 April 1997

Firstpage :

105

Lastpage :

109

Keywords :

Bonding; Electrodes; Flip chip; Gold; Laboratories; Large scale integration; Production; Semiconductor device packaging; Steel; Vacuum arcs;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location :

IEEE

Print_ISBN :

0-7803-4235-6

Type :

conf

Filename :

618987

Link To Document :