• DocumentCode
    315462
  • Title

    Development of Low Cost and Reliable Resin Based PRESS CONTACT Technology

  • Author

    Yoshino, Rei ; Murakami, Toiiioo ; Tanaka, Kei ; Shimada, Toshikazu

  • fYear
    1997
  • fDate
    16-18 April 1997
  • Firstpage
    158
  • Lastpage
    163
  • Keywords
    Assembly; Costs; Electrodes; Epoxy resins; Flip chip; Gold; Joining processes; Large scale integration; Testing; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
  • Conference_Location
    IEEE
  • Print_ISBN
    0-7803-4235-6
  • Type

    conf

  • Filename
    618997
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=315462