DocumentCode
315463
Title
Stud-bump Bonding Technique Onto An Advanced Organic Substrate For MCM-Ls
Author
Amami, K. ; ShiI aishi, T. ; Itagaki, M. ; Bessho, Y. ; Eda, K. ; Ishida, Tomoyuki
fYear
1997
fDate
16-18 April 1997
Firstpage
164
Lastpage
168
Keywords
Bonding; Conductive adhesives; Gold; Large scale integration; Surface-mount technology; Testing; Thermal conductivity; Thermal loading; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
618998
Link To Document