DocumentCode :
315466
Title :
Shape Evolution Of Electrodeposited Bumps -Optimum Resist Angle To Prevent Side Bijmping
Author :
Kondo, Kazuo ; Fukui, Keisuke
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
209
Lastpage :
214
Keywords :
Cathodes; Chemical engineering; Chemistry; Connectors; Current distribution; Laplace equations; Resists; Shape control; Surface resistance; Weight control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619006
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=315466
بازگشت