DocumentCode

315467

Title

TEM Study Of Electrode Structure Formed By Electroless Plating

Author

Matsumura, Kohei ; Kawakita, Tctsuo ; Niwa, Masaaki

fYear

1997

fDate

16-18 April 1997

Firstpage

215

Lastpage

219

Keywords

Amorphous materials; Artificial intelligence; Bonding; Contact resistance; Degradation; Electrodes; Gold; Grain boundaries; Silicon; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619007