Title :
TEM Study Of Electrode Structure Formed By Electroless Plating
Author :
Matsumura, Kohei ; Kawakita, Tctsuo ; Niwa, Masaaki
Keywords :
Amorphous materials; Artificial intelligence; Bonding; Contact resistance; Degradation; Electrodes; Gold; Grain boundaries; Silicon; Substrates;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
