DocumentCode

315470

Title

Electroless Gold Plating For Semiconductor Package Substrate

Author

Hasegawa, Kiyoshi ; Takahashi, Akio ; Nakaso, Akishi

fYear

1997

fDate

16-18 April 1997

Firstpage

230

Lastpage

233

Keywords

Circuits; Copper; Etching; Gold; Heat treatment; Nickel; Semiconductor device packaging; Substrates; Surface contamination; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619010