Title :
Fabrication of CSO Interposer Using 96% Alumina Substrate
Author :
Mohri, Mamoru ; Miyakoshi, Motoharu ; Kidani, Naoki ; Kado, Takashi
Keywords :
Ceramics; Chip scale packaging; Circuits; Conductors; Costs; Fabrication; Joining processes; Substrates; Thermal resistance; Thick films;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
