Title :
Characterizing Two Metal Tbga
Author :
Gengel, Glenn ; Goetz, Martin, Jr.
Keywords :
Assembly; Copper; Electronics packaging; Heat sinks; Optical materials; Polyimides; Routing; Semiconductor device packaging; Substrates; Thermal conductivity;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
