DocumentCode :
3154958
Title :
A compact X-band balanced frequency doubler on GaAs pHEMT 3D MMIC
Author :
Kaho, Takana ; Yamaguchi, Yo ; Okazaki, Hiroshi ; Uehara, Kazuhiro
Author_Institution :
NTT Network Innovation Labs., NTT Corp., Yokosuka, Japan
fYear :
2009
fDate :
Jan. 9 2009-Dec. 11 2009
Firstpage :
237
Lastpage :
240
Abstract :
A compact GaAs pHEMT monolithic microwave integrated circuit balanced frequency doubler is presented. It is composed of a common-source/common-gate active balun, a balanced frequency doubler, and a band pass filter. Excellent miniaturization is achieved by using double-and triple-layer stacked inductors and a miniaturized stub as a band-pass filter with a thin-film microstrip line. The chip size is only 0.95 mm × 1.05 mm and power consumption is 63 mW. The measured conversion gain is -4 dB, and the fundamental and 3rd order frequency leakage to the 2nd order harmonic signal are less than -25 dB and -35 dB respectively.
Keywords :
MMIC frequency convertors; baluns; band-pass filters; frequency multipliers; power HEMT; GaAs; GaAs pHEMT 3D MMIC; band pass filter; common-source/common-gate active balun; compact X-band balanced frequency doubler; frequency leakage; harmonic signal; miniaturized stub; monolithic microwave integrated circuit; power high electron mobility transistors; thin film microstrip line; Band pass filters; Frequency; Gallium arsenide; Impedance matching; MMICs; Microwave integrated circuits; Monolithic integrated circuits; PHEMTs; Thin film circuits; Thin film inductors; 3D MMIC; Active balun; balanced frequency doubler; band-pass filter; monolithic microwave integrated circuit (MMIC); stacked inductor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio-Frequency Integration Technology, 2009. RFIT 2009. IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5031-2
Electronic_ISBN :
978-1-4244-5032-9
Type :
conf
DOI :
10.1109/RFIT.2009.5383706
Filename :
5383706
Link To Document :
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