Design of a full band, compact waveguide-microstrip power splitter using multilayer PCB technology

This paper presents the simulation results for a new dual-probe structure using multilayer PCB technology that is capable of performing power splitting across the whole of w-band frequency band from 75 GHz to 110 GHz. Existing single probe waveguide-to-microstrip transition design was employed for the new multilayered dual-probe structure, which proved to be effective in waveguide-to-microstip transition and power splitting. The new one piece multilayered dual-probe structure will provide ease in assembly, improve consistency and lower the manufacturing cost. Simulation results show that the return loss of the waveguide port to be greater than 10 dB and insertion loss better than 0.5 dB across whole w-band.