Title :
Hierarchical Global Wiring for Custom Chip Design
Author :
Luk, W.K. ; Tang, D.T. ; Wong, C.K.
Author_Institution :
IBM Thomas J. Watson Research Center, Yorktown Heights, NY
Abstract :
We present a global wiring algorithm used in a top-down physical design environment, i.e. macros are laid out only after global wiring is done, and wires are allowed to pass through macros (wiring-through model). The floorplan of the chip is in the form of a slicing structure. The algorithm is based on a hierarchical scheme. The final result is obtained through a series of refinement as the problem is recursively decomposed into a set of small-sized problems and then solved efficiently. Given a balanced slicing tree representation of the floorplan, the worst-case running time of the overall algorithm is O(MN), where M is the number of macros and N the number of nets. The algorithm has been implemented in the C language and has been used for actual chip design. Experiments showed that the hierarchical router performs better than a flat maze type router in wireability handling, equally well in wire length, and much faster in run-time (at least 10 times for an example with 100 macros and 1000 nets, and the gap being even larger for bigger sized problems).
Keywords :
Algorithm design and analysis; Chip scale packaging; Libraries; Linear programming; Logic design; Runtime; Simulated annealing; Very large scale integration; Wires; Wiring;
Conference_Titel :
Design Automation, 1986. 23rd Conference on
Print_ISBN :
0-8186-0702-5
DOI :
10.1109/DAC.1986.1586132