DocumentCode :
3155309
Title :
A low power CMOS single-chip receiver and system-on-package for 60GHz mobile applications
Author :
Lee, Jae Jin ; Jung, Dong Yun ; Eun, Ki Chan ; Oh, Inn Yeal ; Park, Chul Soon
Author_Institution :
Intell. Radio Eng. Center (IREC), Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear :
2009
fDate :
Jan. 9 2009-Dec. 11 2009
Firstpage :
24
Lastpage :
27
Abstract :
A low power single-chip CMOS receiver and system-on-package(SoP) in the low-temperature co-fired ceramic (LTCC) module for 60GHz mobile application are proposed. The single-chip receiver consists of a 4-stage current re-use LNA, Cgs compensating resistive mixer, Ka-band low phase noise VCO, high-suppression frequency doubler, and 2-stage current re-use drive amplifier. The size of the fabricated receiver using a standard 0.13¿m CMOS technology is 2.67mm × 0.75mm including probing pads. An RF bandwidth is 6.2GHz, from 55 to 61.2GHz and an LO tuning range is 7.14GHz, from 48.45GHz to 55.59GHz. The conversion gain and input P1dB are -9.5dB and -12.5dBm, respectively, at RF frequency of 59GHz. The proposed single-chip receiver describes very good noise performances and linearity with very low DC power consumption of only 21.9mW. The CMOS single-chip receiver and a LTCC 2×2 patch array antenna with 8.9dBi antenna gain compose the LTCC SoP module for 60GHz mobile applications.
Keywords :
CMOS integrated circuits; ceramic packaging; low-power electronics; microwave receivers; mobile communication; system-on-package; bandwidth 6.2 GHz; frequency 59 GHz; frequency 60 GHz; frequency 7.14 GHz; gain 8.9 dB; low power CMOS single-chip receiver; low-temperature co-fired ceramic module; mobile applications; patch array antenna; power 21.9 mW; size 0.13 mum; system-on-package; Bandwidth; CMOS technology; Ceramics; Low-noise amplifiers; Mobile antennas; Phase noise; Radio frequency; Radiofrequency amplifiers; Receiving antennas; Voltage-controlled oscillators; 60GHz; CMOS; LTCC; SoP;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio-Frequency Integration Technology, 2009. RFIT 2009. IEEE International Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-5031-2
Electronic_ISBN :
978-1-4244-5032-9
Type :
conf
DOI :
10.1109/RFIT.2009.5383723
Filename :
5383723
Link To Document :
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