DocumentCode :
315610
Title :
Computer-aided design of asymmetric stripline for multichip module applications
Author :
Klimchik, O.V. ; Lopatin, S.D.
Author_Institution :
Dept. of Microelectron., Univ. of Inf. Radioelectron., Minsk, Byelorussia
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
216
Abstract :
Summary form only given. Design of interconnect has become the key to the success of the high performance ULSI, multilevel metallization systems for the multichip module. Computer-aided design of the characteristic impedances, capacitance, and working frequency of Al asymmetric stripline filled by anodic oxide of Al with a dielectric constant 4-6 for a multilayer scheme in hybrid multichip module. RLC-model of the Al transmission line was successfully used for the calculation of frequency. Using conformal mapping, the functional dependance of the characteristic impedance and frequency from the capacitance of a filled anodic oxide Al stripline can be determined. To evaluate this model and characterise its performance with highspeed electrical multichip module design, a test cell using a multilayer interconnect structure Al/anodic Al oxide on an aluminum substrate was developed.
Keywords :
circuit CAD; integrated circuit interconnections; multichip modules; strip lines; Al-Al/sub 2/O/sub 3/; RLC-model; ULSI; aluminum substrate; anodic Al oxide; asymmetric stripline; capacitance; characteristic impedance; computer-aided design; conformal mapping; dielectric constant; frequency; high-speed hybrid multichip module; interconnect; multilevel metallization; transmission line; Capacitance-voltage characteristics; Design automation; Dielectric constant; Impedance; Metallization; Multichip modules; Nonhomogeneous media; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1997.621128
Filename :
621128
Link To Document :
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