DocumentCode
3156267
Title
Comparison of surface temperature readings between an embedded thermocouple in a silicon wafer and a hybrid-type temperature sensor
Author
Gogami, Atsushi ; Iuchi, Tohru
Author_Institution
Sch. of Eng., Toyo Univ., Kawagoe
fYear
2008
fDate
20-22 Aug. 2008
Firstpage
1626
Lastpage
1631
Abstract
We compared the surface temperature readings of silicon wafers between the embedded thermocouple and the hybrid-type surface sensor which the authors developed. Uncertainties of both sensors are roughly 1 K in the temperature range between 600 and 1000 K. But, the hybrid-type surface sensor has an overwhelmed advantage that can continuously be carried out without leaving the atmosphere in a process. Therefore, the sensor has potential for in situ calibrations of temperature measurements in silicon manufacturing processes. In this paper, the environment and experimental setup for the comparison of temperature readings linked to the temperature standards and the uncertainties of both methods are described in detail.
Keywords
intelligent sensors; silicon; temperature sensors; thermocouples; embedded thermocouple; hybrid-type temperature sensor; silicon wafer; surface temperature readings; Atmosphere; Calibration; Manufacturing processes; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Temperature measurement; Temperature sensors; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
SICE Annual Conference, 2008
Conference_Location
Tokyo
Print_ISBN
978-4-907764-30-2
Electronic_ISBN
978-4-907764-29-6
Type
conf
DOI
10.1109/SICE.2008.4654923
Filename
4654923
Link To Document