• DocumentCode
    3156267
  • Title

    Comparison of surface temperature readings between an embedded thermocouple in a silicon wafer and a hybrid-type temperature sensor

  • Author

    Gogami, Atsushi ; Iuchi, Tohru

  • Author_Institution
    Sch. of Eng., Toyo Univ., Kawagoe
  • fYear
    2008
  • fDate
    20-22 Aug. 2008
  • Firstpage
    1626
  • Lastpage
    1631
  • Abstract
    We compared the surface temperature readings of silicon wafers between the embedded thermocouple and the hybrid-type surface sensor which the authors developed. Uncertainties of both sensors are roughly 1 K in the temperature range between 600 and 1000 K. But, the hybrid-type surface sensor has an overwhelmed advantage that can continuously be carried out without leaving the atmosphere in a process. Therefore, the sensor has potential for in situ calibrations of temperature measurements in silicon manufacturing processes. In this paper, the environment and experimental setup for the comparison of temperature readings linked to the temperature standards and the uncertainties of both methods are described in detail.
  • Keywords
    intelligent sensors; silicon; temperature sensors; thermocouples; embedded thermocouple; hybrid-type temperature sensor; silicon wafer; surface temperature readings; Atmosphere; Calibration; Manufacturing processes; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Temperature measurement; Temperature sensors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SICE Annual Conference, 2008
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-4-907764-30-2
  • Electronic_ISBN
    978-4-907764-29-6
  • Type

    conf

  • DOI
    10.1109/SICE.2008.4654923
  • Filename
    4654923