DocumentCode :
3156267
Title :
Comparison of surface temperature readings between an embedded thermocouple in a silicon wafer and a hybrid-type temperature sensor
Author :
Gogami, Atsushi ; Iuchi, Tohru
Author_Institution :
Sch. of Eng., Toyo Univ., Kawagoe
fYear :
2008
fDate :
20-22 Aug. 2008
Firstpage :
1626
Lastpage :
1631
Abstract :
We compared the surface temperature readings of silicon wafers between the embedded thermocouple and the hybrid-type surface sensor which the authors developed. Uncertainties of both sensors are roughly 1 K in the temperature range between 600 and 1000 K. But, the hybrid-type surface sensor has an overwhelmed advantage that can continuously be carried out without leaving the atmosphere in a process. Therefore, the sensor has potential for in situ calibrations of temperature measurements in silicon manufacturing processes. In this paper, the environment and experimental setup for the comparison of temperature readings linked to the temperature standards and the uncertainties of both methods are described in detail.
Keywords :
intelligent sensors; silicon; temperature sensors; thermocouples; embedded thermocouple; hybrid-type temperature sensor; silicon wafer; surface temperature readings; Atmosphere; Calibration; Manufacturing processes; Rough surfaces; Silicon; Surface roughness; Temperature distribution; Temperature measurement; Temperature sensors; Thermal sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SICE Annual Conference, 2008
Conference_Location :
Tokyo
Print_ISBN :
978-4-907764-30-2
Electronic_ISBN :
978-4-907764-29-6
Type :
conf
DOI :
10.1109/SICE.2008.4654923
Filename :
4654923
Link To Document :
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