• DocumentCode
    3156340
  • Title

    Development of HoBCO thin film for SN transition type fault current limiter

  • Author

    Ohmatsu, K. ; Hahakura, S. ; Takei, H. ; Ozawa, Y.

  • Author_Institution
    Sumitomo Electr. Ind. Ltd., Osaka, Japan
  • Volume
    3
  • fYear
    2002
  • fDate
    6-10 Oct. 2002
  • Firstpage
    2318
  • Abstract
    The authors have developed large-area Ho1Ba2Cu3Ox (HoBCO) thin films on sapphire (Al2O3) single crystal substrates for SN transition type fault current limiter. Two types of pulsed laser deposition (PLD) method, the rotation PLD method and the two-dimensional (2-D) scanning PLD method, have been used for preparing uniform large-area thin films. Using the rotation PLD method, 3cm × 7cm size HoBCO thin films were successfully prepared. 3cm × 7cm HoBCO thin films showed excellent crystal growth and high uniformity of film thickness and critical temperature (Tc). Critical current densities (Jc) were 1.9∼2.0 MA/cm2 at 77 K. Using the 2-D scanning PLD method, 3cm × 10cm size HoBCO thin films have also been developed. 3cm × 10cm HoBCO thin films showed high uniformity of film thickness and high Jc over 3.0 MA/cm2 at 77 K.
  • Keywords
    barium compounds; copper compounds; fault current limiters; high-temperature superconductors; holmium compounds; pulsed laser deposition; sapphire; substrates; superconducting devices; thin films; 10 cm; 3 cm; 7 cm; 77 K; Al2O3; Ho1Ba2Cu3Ox; HoBCO; HoBCO thin film development; SN transition-type fault current limiter; critical current densities; critical temperature; crystal growth; film thickness uniformity; pulsed laser deposition; rotation PLD method; sapphire single crystal substrates; two-dimensional scanning PLD method; uniform large-area thin films; Fault current limiters; Laser transitions; Optical pulses; Pulsed laser deposition; Sputtering; Substrates; Temperature; Tin; Transistors; Two dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission and Distribution Conference and Exhibition 2002: Asia Pacific. IEEE/PES
  • Print_ISBN
    0-7803-7525-4
  • Type

    conf

  • DOI
    10.1109/TDC.2002.1177826
  • Filename
    1177826