Title :
A Low Cost Packaging Solution for Microwave Applications
Author :
Wormald, R. ; David, S. ; Panaghiston, G. ; Jeffries, R.
Author_Institution :
Filtronic, West Yorkshire
Abstract :
Lower cost solutions for packaging GaAs pHEMT devices, MMIC´s and multi chip modules (MCM´s) are now an essential requirement for high-rel military applications. This is very apparent in phased array applications where a large number of modules can have significant cost implications. A potential, novel, near hermetic and cost effective packaging solution, available in low to medium volumes, using liquid crystal polymer (LCP) laminates and conventional PCB manufacturing techniques is discussed
Keywords :
MMIC; high electron mobility transistors; laminates; liquid crystal polymers; microwave field effect transistors; multichip modules; printed circuit manufacture; GaAs; MMIC; PCB manufacturing techniques; high-reliability military applications; liquid crystal polymer laminates; low cost packaging; microwave applications; multi chip modules; near hermetic packaging; pHEMT devices; phased array applications; Circuits; Copper; Costs; Dielectrics; Electromagnetic heating; Laminates; Liquid crystal polymers; Packaging; Phased arrays; Radio frequency; Liquid crystalline polymer (LCP); Packaging;
Conference_Titel :
European Microwave Integrated Circuits Conference, 2006. The 1st
Conference_Location :
Manchester
Print_ISBN :
2-9600551-8-7
DOI :
10.1109/EMICC.2006.282788
