• DocumentCode
    3157430
  • Title

    3D system-in-package integration of 60 GHz aperture-coupled micromachined microstrip antennas

  • Author

    Brebels, S. ; Mohammadpour-Aghdam, Karim ; De Raedt, W. ; Vandenbosch, G.

  • Author_Institution
    IMEC, Heverlee, Belgium
  • fYear
    2010
  • fDate
    23-28 May 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    An integrated aperture-coupled microstrip antenna for 60 GHz is introduced with the patch element on the inside of the micromachined air cavity. The patch is therefore protected from the outside environment. The coupling of patch and cavity resonance leads further to a compact yet wideband antenna solution. This antenna is a good candidate for realizing active integrated antenna modules in high-resistivity Silicon.
  • Keywords
    Aperture antennas; Broadband antennas; Fabrication; Microstrip antenna arrays; Microstrip antennas; Phased arrays; Protection; Resonance; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-6056-4
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2010.5518294
  • Filename
    5518294