• DocumentCode
    3158297
  • Title

    Influence of Interconnect Parasitics on the Lateral Scaling of SiGe Power HBTs

  • Author

    Wang, Guogong ; Yuan, Hao-Chih ; Ma, Zhenqiang

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wisconsin-Madison Univ., Madison, WI
  • fYear
    2006
  • fDate
    10-13 Sept. 2006
  • Firstpage
    472
  • Lastpage
    475
  • Abstract
    The influence of interconnect parasitics on the lateral scaling of emitter stripe width of large-area SiGe power heterojunction bipolar transistors (HBTs) are analytically studied and experimentally verified. It is found that, due to the increased parasitics along with the increase of device area, the maximum oscillation frequency (fmax ) of a power SiGe HBT cannot be improved monotonically with the shrinking of the emitter stripe width, which is different from the downscaling of the low-power (few emitter stripes) counterparts. Instead, the emitter stripe width of large-area devices ought to be appropriately up-scaled, relative to that of low-power devices, in order to optimize the RF performance of large-area SiGe power HBTs. It is also found that the influences of interconnect parasitics on the fmax and the power gain (Gmax) for common-emitter (CE) and for common-base (CB) SiGe power HBTs are different
  • Keywords
    Ge-Si alloys; frequency response; interconnections; power bipolar transistors; RF performance; SiGe; common-base HBT; common-emitter HBT; emitter stripe width; interconnect parasitics; lateral scaling; maximum oscillation frequency; power gain; power heterojunction bipolar transistors; Contact resistance; Doping; Frequency response; Gallium arsenide; Germanium silicon alloys; Heterojunction bipolar transistors; Integrated circuit interconnections; Joining processes; Radio frequency; Silicon germanium; Common-base (CB); SiGe; common-emitter (CE); emitter stripe width; heterojunction bipolar transistors (HBT); interconnect parasitics; lateral scaling; maximum oscillation frequency (fmax); power HBT; power gain (Gmax);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Microwave Integrated Circuits Conference, 2006. The 1st
  • Conference_Location
    Manchester
  • Print_ISBN
    2-9600551-8-7
  • Type

    conf

  • DOI
    10.1109/EMICC.2006.282685
  • Filename
    4057679