Thermal Characterisation of LTCC Frontend Modules with Integrated Power Amplifiers for Wireless LAN Application

Author

Markov, Kostyantyn ; Keiler, Torsten ; Chernyakov, Alexander ; Curtin, Ciaran ; Heide, Patric

Author_Institution

Product Dev. Modules, EPCOS AG, Munich

fYear

2006

fDate

10-13 Sept. 2006

Firstpage

548

Lastpage

551

Abstract

This paper investigates the design and evaluation of low temperature co-fired ceramic (LTCC) heatsinks in frontend modules (FEMs) with integrated power amplifiers (PAs) for wireless-LAN IEEE 802.11 applications. The thermal resistance of this heatsink is measured using two chip thermistors and the accuracy of the proposed measurement method is determined. This method is experimentally validated by the high temperature operating life (HTOL) test, and reliability data is extracted for an EPCOS WLAN FEM with integrated PA, which is currently in mass production

Keywords

ceramic packaging; heat sinks; power amplifiers; thermal resistance; thermistors; wireless LAN; chip thermistors; frontend modules; high temperature operating life test; integrated power amplifiers; low temperature co-fired ceramic heatsinks; thermal resistance; wireless LAN; Ceramics; Electrical resistance measurement; Heat sinks; Life testing; Power amplifiers; Semiconductor device measurement; Temperature; Thermal resistance; Thermistors; Wireless LAN; LTCC; Thermal resistance; modules; thermistors;

fLanguage

English

Publisher

ieee

Conference_Titel

European Microwave Integrated Circuits Conference, 2006. The 1st

Conference_Location

Manchester

Print_ISBN

2-9600551-8-7

Type

conf

DOI

10.1109/EMICC.2006.282705

Filename

4057699