A New Compact 3-D Hybrid Coupler Using Multi-Layer Microstrip Lines at 15 GHz

Author

Jung Gil Yang ; Jeong, Yongsik ; Choi, Sunkyu ; Yang, Kyounghoon

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon

fYear

2006

fDate

10-15 Sept. 2006

Firstpage

25

Lastpage

28

Abstract

This paper presents a new compact 90deg hybrid coupler using thin-film microstrip and inverted microstrip lines for monolithic microwave integrated circuit (MMIC) applications. In order to reduce an intrinsic circuit area of the hybrid coupler, a compact meandered line configuration and a new multi-layer structure design have been adopted. The configuration and structural dimensions of the multi-layer structure were designed and investigated through detailed 3D electromagnetic simulations. The proposed 3D hybrid coupler was realized using a developed benzocyclobutene (BCB)-based multi-layer MMIC technology. The intrinsic area of the fabricated 3D hybrid coupler is significantly reduced compared to that of a conventional hybrid coupler using the 2D meandered line configuration

Keywords

MMIC; microstrip couplers; 15 GHz; 2D meandered line configuration; 3D electromagnetic simulations; 3D hybrid coupler; benzocyclobutene; inverted microstrip lines; monolithic microwave integrated circuit; multilayer MMIC technology; multilayer microstrip lines; thin-film microstrip lines; Coupling circuits; Distributed parameter circuits; Impedance; MIM capacitors; MMICs; Microstrip; Topology; Transistors; Transmission line matrix methods; Transmission lines; 90Â° hybrid coupler; BCB; MMIC; meandered line; multi-layer structure;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2006. 36th European

Conference_Location

Manchester

Print_ISBN

2-9600551-6-0

Type

conf

DOI

10.1109/EUMC.2006.281172

Filename

4057737