DocumentCode :
3159688
Title :
Feasibility tests of SiC thin films by sputtering
Author :
Axelevitch, A. ; Vainshtok, E. ; Sigalov, B. ; Gorenstein, B. ; Golan, G.
Author_Institution :
Holon Acad. Inst. of Technol., Israel
fYear :
2002
fDate :
1 Dec. 2002
Firstpage :
55
Abstract :
Summary form only given. Silicon carbide (SiC) is one of the most important materials in recent years. SiC single crystalline substrates are used for high-temperature and fast-acting electron devices. The hydrogenated amorphous silicon-carbide alloy thin films have been of technical interest as an optoelectronic material. These films have important applications also as p-type layers in amorphous silicon photovoltaic devices. Common methods applied for silicon carbide films deposition are plasma enhanced CVD under plasma decomposition of organic compounds such as CH4, C2H2, C3H8. In this paper, SixCy thin films were deposited on silicon and glass substrates using magnetron DC sputtering, a ceramic SiC target and argon plasma. Sputtering was provided as a continuous process and as a consequent sputtering of two targets: ceramic SiC and single crystalline Si. Optical, and dielectric properties of the obtained films were investigated. The obtained films were transparent and behaved as dielectric in the Al-SixCy-Al and Al-SixCy-Si structures.
Keywords :
MIS structures; semiconductor growth; semiconductor thin films; silicon compounds; sputtered coatings; transparency; wide band gap semiconductors; Al-SixCy-Al structure; Al-SixCy-Si structure; Al-SiC-Al; Al-SiC-Si; SiC; SiC thin film; dielectric properties; glass substrate; magnetron DC sputtering; optical properties; silicon substrate; transparency; Crystalline materials; Crystallization; Optical films; Plasma applications; Plasma devices; Semiconductor films; Semiconductor thin films; Silicon carbide; Sputtering; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical and Electronics Engineers in Israel, 2002. The 22nd Convention of
Print_ISBN :
0-7803-7693-5
Type :
conf
DOI :
10.1109/EEEI.2002.1178318
Filename :
1178318
Link To Document :
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