Title :
Table of contents
Abstract :
The following topics are dealt with: advanced packaging; emerging technologies; electrical modeling and signal integrity; thermal characterization and cooling solutions; interconnection technologies; manufacturing technologies; mechanical modeling and structural integrity; quality and reliability; materials and processes.
Keywords :
cooling; electronics packaging; integrated circuit interconnections; manufacturing processes; quality assurance; reliability; advanced packaging; cooling solutions; electrical modeling; electronics packaging technology; interconnection technologies; manufacturing technologies; materials; mechanical modeling; processes; quality; reliability; signal integrity; structural integrity; thermal characterization;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1324-9
DOI :
10.1109/EPTC.2007.4469676
