DocumentCode :
3160223
Title :
Wire Sweep Improvement Study for Fine Pitch Device
Author :
Liu, J.M. ; Yao, J.Z. ; Wei, Gao ; Lu, Y.S.
Author_Institution :
Freescale Semicond. (China) Ltd., Shenzhen
fYear :
2007
fDate :
10-12 Dec. 2007
Firstpage :
61
Lastpage :
65
Abstract :
This paper presents the results of a wire sweep improvement study for fine pitch devices. With 44mum fine pitch device as test vehicle, on one hand, transfer mold process optimization with transfer profile was performed and wire sweep was controlled below 5%; on the other hand, new FFT (Flow Free Thin) mold technology with new granular compound was also evaluated to improve wire sweep and it can get excellent wire sweep control within 1.5%. With 40mum fine pitch device as test vehicle, the stiffer gold wire (2N type, 99% Au purity) was also tried for comparison with current gold wire (3N type, 99.9% Au purity) and the wire sweep data showed a large improvement on 2N wire. All the study experience will guide further study in ultra fine pitch (37mum or 35mum) and fine gold wire (0.7mils or 0.6mils).
Keywords :
electronics packaging; moulding; wires (electric); Au; fine pitch device; flow free thin mold technology; granular compound; transfer mold process optimization; transfer profile; wire sweep improvement study; Bonding; Electronic equipment testing; Gold; Laboratories; Performance evaluation; Semiconductor device packaging; Strips; Vehicles; Vents; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
Type :
conf
DOI :
10.1109/EPTC.2007.4469697
Filename :
4469697
Link To Document :
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