Fabrication and Characterization of Multi-layer Liquid Crystal Polymer (LCP) Substrate

Author

Haijing, Lu ; Lai, Wai Lai ; Wen, Gian Pung ; Huat, Lim Lay ; Zheng, Sun ; Wai, Albert Lu Chee

Author_Institution

Singapore Inst. of Manuf. Technol. (SIMTech), Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

514

Lastpage

517

Abstract

The liquid crystal polymer (LCP) material is a unique class of high temperature thermoplastic. It offers a combination of electrical, thermal, mechanical and chemical properties unmatched by conventional polymers. LCP has very stable and low-loss dielectric characteristics. In addition, the moisture absorption is very low. This paper describes the multi-layer substrate fabrication process and the test vehicle design. Network analyzer measurement up to 20 GHz for transmission line characterization was also performed.

Keywords

dielectric materials; integrated circuit interconnections; liquid crystal polymers; materials testing; network analysers; plastics; high temperature thermoplastic; high-density interconnection; multilayer circuit integration; multilayer liquid crystal polymer substrate; multilayer substrate fabrication process; network analyzer measurement; test vehicle design; transmission line characterization; Absorption; Chemicals; Crystalline materials; Dielectric materials; Dielectric substrates; Fabrication; Liquid crystal polymers; Mechanical factors; Moisture; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469699

Filename

4469699