The Improvement of Sweep Stiffness and Thermomechanical Properties of Wire Bonds for Pure Gold Wire with Dopant

Author

Kung, Huang-Kuang ; Chen, Hung-Shyong ; Lee, Jeng-Nan ; Sun, Yun-Ping

Author_Institution

Cheng Shiu Univ., Kaohsiung

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

66

Lastpage

70

Abstract

The materials used in this study were three types of gold wire: SR-Y, high-loop wire; FA type, middle-loop wire; and GL-2, low-loop wire. All of these wires are composed of high-purity gold with various dopants added to obtain greater strength and stiffness. The three types of gold wire are gold alloys of 99.99% purity with less than 100 ppm of non-gold dopants. The major difference among these three types of wires is the concentration of calcium dopant: SR-Y, 1 ppm; FA, 6 ppm; and GL-2, 24 ppm. The effects of a calcium dopant on the thermomechanical properties of three types of gold-bonding wires were investigated. The sweep stiffness were measured for various bond spans and bond heights of three types of wire and was shown to increase with increased concentration of calcium.

Keywords

calcium; elasticity; gold; integrated circuit bonding; integrated circuit packaging; lead bonding; wires; Au:Ca; FA type middle-loop wire; GL-2 low-loop wire; SR-Y high-loop wire; calcium dopant concentration; gold wire; sweep stiffness; thermomechanical properties; wire bonds; Bonding; Calcium; Electronics packaging; Gold alloys; Microelectronics; Semiconductor device packaging; Temperature; Testing; Thermomechanical processes; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469703

Filename

4469703