DocumentCode
3160447
Title
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)
fYear
2001
fDate
May 29 2001-June 1 2001
Abstract
This international conference attempts to bring together the best in packaging, components, microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The technical sessions focus on leading edge developments and technical innovations in several areas, including: optoelectronics, advanced packaging technologies, high performance package design, simulation and manufacturing, interconnections and reliability
Keywords
packaging; education; electronic components; interconnections; manufacturing processes; microelectronic systems; numerical simulation; optoelectronics; package design; packaging technology; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location
Orlando, FL, USA
ISSN
0569-5503
Print_ISBN
0-7803-7038-4
Type
conf
DOI
10.1109/ECTC.2001.927619
Filename
927619
Link To Document