Evolution of Microstructure and Mechanical Properties of Eutectic Sn-Pb Solder Joint Aged under Thermal Gradient

Author

Kumar, Aditya ; Chiew, O.S. ; Wong, C.C. ; Chen, Zhong ; Yoon, S.W. ; Kripesh, Vaidyanathan

Author_Institution

Inst. of Microelectron., Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

533

Lastpage

540

Abstract

Thermal gradients exist in solder joints used in high power device packages due to high device temperature and low substrate temperature. This paper presents the effect of thermal gradient on the microstructure and mechanical properties of eutectic Sn-37Pb solder joint. The solder joint comprises a multilayered Cu/electroless Ni-P/Sn-37Pb/electroless Ni-P/Cu material system. Thermal gradients ranging from 1.3 times 10³ to 1.5 times 10³degC/cm were imposed on the solder joint by heating its one end and cooling the other. The thermal gradient in the solder joint has been found to influence the size distribution of Sn-rich and Pb-rich phases, solder composition, and fracture behavior. An explanation of these thermal gradient induced phenomena is provided.

Keywords

electronics packaging; mechanical properties; solders; Cu; NiP; SnPb; eutectic Sn-Pb solder joint; mechanical properties; microstructure; power device packages; thermal gradient; Aging; Electronic packaging thermal management; Materials science and technology; Mechanical factors; Microstructure; Soldering; Substrates; Temperature; Thermal conductivity; Thermal engineering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469714

Filename

4469714