DocumentCode
31606
Title
Batch-Producible Fiber-Optic Fabry–Pérot Sensor for Simultaneous Pressure and Temperature Sensing
Author
Jinde Yin ; Tiegen Liu ; Junfeng Jiang ; Kun Liu ; Shuang Wang ; Zunqi Qin ; Shengliang Zou
Author_Institution
Key Lab. of Optoelectron. Inf. Technol., Tianjin Univ., Tianjin, China
Volume
26
Issue
20
fYear
2014
fDate
Oct.15, 15 2014
Firstpage
2070
Lastpage
2073
Abstract
We demonstrated a simple and batch-producible fiber-optic sensor based on hybrid Fabry-Pérot (FP) configuration for simultaneous pressure and temperature sensing. The proposed sensor head chips are batch fabricated by double-sided anodic bonding of a through-holes-array-structured glass wafer and two silicon wafers. The silicon-glass-silicon sandwich bonding structure constructs two serially connected low-finesse FP cavities naturally. The first cavity (FP1) is a silicon cavity and utilizes the refractive indices temperature dependence of silicon to achieve temperature sensing. The second cavity (FP2) is a vacuum cavity and employs a thin silicon diaphragm as a pressure sensing element. The reflection spectra exhibit hybrid interference fringes with different frequencies produced by silicon and vacuum cavity, and the temperature and pressure are simultaneously measured. Experiment results demonstrate that the pressure sensitivity of FP2 is 12.82 nm/kPa with a high linear pressure response over the range of 10-250 kPa, and the temperature sensitivity of FP1 is 142.02 nm/°C under the range of -20 °C-70 °C.
Keywords
Fabry-Perot interferometers; elemental semiconductors; fibre optic sensors; light interference; optical fibre fabrication; pressure sensors; refractive index; silicon; temperature sensors; batch-producible fiber-optic Fabry-Pérot sensor; double-sided anodic bonding; hybrid interference fringes; low-finesse FP cavities; pressure 10 kPa to 250 kPa; pressure sensing; reflection spectra; refractive indices; sensor head chips; silicon wafers; silicon-glass-silicon sandwich bonding structure; temperature -20 degC to 70 degC; temperature sensing; temperature sensitivity; thin silicon diaphragm; through-holes-array-structured glass wafer; vacuum cavity; Cavity resonators; Optical fiber sensors; Optical fibers; Reflection; Silicon; Temperature measurement; Temperature sensors; Fabry-P??rot; Fiber optics sensor; optical microelectromechanical devices; spectrum analysis;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2014.2347055
Filename
6879460
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