• DocumentCode
    31606
  • Title

    Batch-Producible Fiber-Optic Fabry–Pérot Sensor for Simultaneous Pressure and Temperature Sensing

  • Author

    Jinde Yin ; Tiegen Liu ; Junfeng Jiang ; Kun Liu ; Shuang Wang ; Zunqi Qin ; Shengliang Zou

  • Author_Institution
    Key Lab. of Optoelectron. Inf. Technol., Tianjin Univ., Tianjin, China
  • Volume
    26
  • Issue
    20
  • fYear
    2014
  • fDate
    Oct.15, 15 2014
  • Firstpage
    2070
  • Lastpage
    2073
  • Abstract
    We demonstrated a simple and batch-producible fiber-optic sensor based on hybrid Fabry-Pérot (FP) configuration for simultaneous pressure and temperature sensing. The proposed sensor head chips are batch fabricated by double-sided anodic bonding of a through-holes-array-structured glass wafer and two silicon wafers. The silicon-glass-silicon sandwich bonding structure constructs two serially connected low-finesse FP cavities naturally. The first cavity (FP1) is a silicon cavity and utilizes the refractive indices temperature dependence of silicon to achieve temperature sensing. The second cavity (FP2) is a vacuum cavity and employs a thin silicon diaphragm as a pressure sensing element. The reflection spectra exhibit hybrid interference fringes with different frequencies produced by silicon and vacuum cavity, and the temperature and pressure are simultaneously measured. Experiment results demonstrate that the pressure sensitivity of FP2 is 12.82 nm/kPa with a high linear pressure response over the range of 10-250 kPa, and the temperature sensitivity of FP1 is 142.02 nm/°C under the range of -20 °C-70 °C.
  • Keywords
    Fabry-Perot interferometers; elemental semiconductors; fibre optic sensors; light interference; optical fibre fabrication; pressure sensors; refractive index; silicon; temperature sensors; batch-producible fiber-optic Fabry-Pérot sensor; double-sided anodic bonding; hybrid interference fringes; low-finesse FP cavities; pressure 10 kPa to 250 kPa; pressure sensing; reflection spectra; refractive indices; sensor head chips; silicon wafers; silicon-glass-silicon sandwich bonding structure; temperature -20 degC to 70 degC; temperature sensing; temperature sensitivity; thin silicon diaphragm; through-holes-array-structured glass wafer; vacuum cavity; Cavity resonators; Optical fiber sensors; Optical fibers; Reflection; Silicon; Temperature measurement; Temperature sensors; Fabry-P??rot; Fiber optics sensor; optical microelectromechanical devices; spectrum analysis;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2014.2347055
  • Filename
    6879460