Board-level Reliability of Package-on-Package Stacking Assemblies Subjected to Coupled Power and Thermal Cycling Tests

Author

Wang, Tong Hong ; Lai, Yi-Shao ; Lee, Chang-Chi ; Wang, Ching-Chun

Author_Institution

Adv. Semicond. Eng., Inc., Kaohsiung

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

21

Lastpage

26

Abstract

In this work, the sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is performed to investigate thermal characteristics along with fatigue reliability of a board-level package-on-package (PoP) stacking assembly under coupled power and thermal cycling test conditions. Effects of powering sequences on thermal characteristics and fatigue reliability of the PoP are examined.

Keywords

assembling; electronics packaging; fatigue testing; reliability; stacking; board-level reliability; coupled power; fatigue reliability; package-on-package stacking assembly; sequential thermal-mechanical coupling analysis; subsequent thermomechanical deformation; thermal characteristics; thermal cycling test condition; transient temperature field; Assembly; Fatigue; Packaging; Performance analysis; Performance evaluation; Stacking; Temperature; Testing; Thermomechanical processes; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469727

Filename

4469727