Title :
Thermal Performance Evaluation of Power SSL Module in LTCC
Author :
Shi, Peter Z. ; Arulvanan, P. ; Lu, Albert C W
Author_Institution :
Singapore Inst. of Manuf. Technol., Singapore
Abstract :
The potential of SSL (solid-state lighting) is boundless, and SSL is the future of light. However with the heat flux increasing rapidly with high-power LEDs, thermal management is critically important for the light quality and lighting reliability in the power LED lighting system. By leveraging our low temperature co-fired ceramic (LTCC) technology, we have designed and fabricated an LTCC-based power SSL engine which consists of arrays of 36 LEDs with a total power of 36 watts and a on-chip power density of 100 W/cm2. The thermal performance evaluation and experimental validation of the light engine were carried out. Based on the thermal simulation and experimentation, we can conclude that the correlation between the experimental and simulation results is very good. The junction-board thermal resistance is 0.52degC/W for the power SSL module with an array of 36 LEDs.
Keywords :
arrays; ceramics; firing (materials); light emitting diodes; light sources; low-temperature techniques; thermal conductivity; thermal management (packaging); thermal resistance; LED array; LTCC; heat flux; junction-board thermal resistance; light quality; lighting reliability; low temperature co-fired ceramic technology; on-chip power density; power 36 W; power LED lighting system; power solid-state lighting module; thermal management; thermal performance evaluation; thermal simulation; Energy management; Engines; LED lamps; Light emitting diodes; Power system management; Power system reliability; Quality management; Solid state lighting; Thermal management; Thermal resistance;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469728
