• DocumentCode
    3160885
  • Title

    Simulated and Experimental Thermal Analysis of Home Entertainment Server

  • Author

    Boon, Chong Nyok ; Yong, Law Sie ; Kong, Foong Foo ; Jong, Kim Han ; Hong, Ong Eng

  • Author_Institution
    Data Storage Inst., Singapore
  • fYear
    2007
  • fDate
    10-12 Dec. 2007
  • Firstpage
    888
  • Lastpage
    891
  • Abstract
    This paper describes the simulated and experimental thermal analysis of a home entertainment server (home server). Heat dissipation per unit area in consumer electronics is set to increase tremendously with increasing product functions and the trend of slimmer, smaller and aesthetic looking in product design. This trend poses a challenge to thermal management of such products. To ensure good reliability and functionality, thermal design and thermal simulation for our home server have been carried out prior to prototyping. Simulated temperatures of two hard disk drives (HDDs), central processing unit (CPU) obtained from the thermal analysis are 38.4, 40.2 and 78.5degC respectively. Temperature measurement results show good agreement with simulated results with an average error of 10%. Both measurement and simulated results of HDDs and CPU fall within their recommended working temperature regime.
  • Keywords
    consumer electronics; disc drives; hard discs; microprocessor chips; thermal analysis; thermal management (packaging); central processing unit; consumer electronics; hard disk drives; heat dissipation; home entertainment server; product design; reliability; temperature 38.4 C to 78.5 C; thermal analysis; thermal management; Acoustic noise; Analytical models; Central Processing Unit; Computational modeling; Consumer electronics; Network servers; Product design; Temperature measurement; Thermal engineering; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-1323-2
  • Electronic_ISBN
    978-1-4244-1323-2
  • Type

    conf

  • DOI
    10.1109/EPTC.2007.4469732
  • Filename
    4469732