DocumentCode
3160885
Title
Simulated and Experimental Thermal Analysis of Home Entertainment Server
Author
Boon, Chong Nyok ; Yong, Law Sie ; Kong, Foong Foo ; Jong, Kim Han ; Hong, Ong Eng
Author_Institution
Data Storage Inst., Singapore
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
888
Lastpage
891
Abstract
This paper describes the simulated and experimental thermal analysis of a home entertainment server (home server). Heat dissipation per unit area in consumer electronics is set to increase tremendously with increasing product functions and the trend of slimmer, smaller and aesthetic looking in product design. This trend poses a challenge to thermal management of such products. To ensure good reliability and functionality, thermal design and thermal simulation for our home server have been carried out prior to prototyping. Simulated temperatures of two hard disk drives (HDDs), central processing unit (CPU) obtained from the thermal analysis are 38.4, 40.2 and 78.5degC respectively. Temperature measurement results show good agreement with simulated results with an average error of 10%. Both measurement and simulated results of HDDs and CPU fall within their recommended working temperature regime.
Keywords
consumer electronics; disc drives; hard discs; microprocessor chips; thermal analysis; thermal management (packaging); central processing unit; consumer electronics; hard disk drives; heat dissipation; home entertainment server; product design; reliability; temperature 38.4 C to 78.5 C; thermal analysis; thermal management; Acoustic noise; Analytical models; Central Processing Unit; Computational modeling; Consumer electronics; Network servers; Product design; Temperature measurement; Thermal engineering; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469732
Filename
4469732
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