DocumentCode :
3160901
Title :
Characterisation of TFMS and CPW Lines and Interconnections up to 100 GHz in Multilayer Photoimageable Thick Film Technology
Author :
Samanta, K.K. ; Robertson, I.D.
Author_Institution :
Sch. of Electron. & Electr. Eng., Leeds Univ.
fYear :
2006
fDate :
10-15 Sept. 2006
Firstpage :
376
Lastpage :
379
Abstract :
This paper describes the characterisation of a photoimageable multilayer thick film process up to 100 GHz using a side-coupled TFMS linear microstrip resonator. The technique yields more consistent results than previous ring resonator work. The TFMS and CPW transmission lines and wideband layer to layer transition are also characterised up to 100 GHz for multilayer MCM application. Up to 80 GHz the TFMS and CPW lines exhibit low loss of <0.25dB/mm and the layer-to-layer transitions demonstrate extremely low loss of < 0.1dB. This performance is better than many reported results for thin film technology
Keywords :
coplanar waveguides; integrated circuit interconnections; microstrip lines; microstrip resonators; multichip modules; thick films; CPW transmission lines; TFMS transmission lines; coplanar waveguides; interconnections; linear microstrip resonator; microstrip lines; multichip modules; multilayer MCM application; multilayer photoimageable thick film; wideband layer; Coplanar waveguides; Dielectric losses; Dielectric materials; Dielectric thin films; Feeds; Frequency measurement; Microstrip resonators; Nonhomogeneous media; Space technology; Thick films; Microstrip lines; coplanar waveguides; multichip modules;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2006. 36th European
Conference_Location :
Manchester
Print_ISBN :
2-9600551-6-0
Type :
conf
DOI :
10.1109/EUMC.2006.281352
Filename :
4057828
Link To Document :
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