DocumentCode
3160923
Title
Multi-layer Lamination of Embedded Channels in Low Shrinkage Ceramics based Platform
Author
Khoong, L.E. ; Tan, Y.M. ; Lam, Y.C. ; Lu, C.W.
Author_Institution
Singapore Inst. of Manuf. Technol., Singapore
fYear
2007
fDate
10-12 Dec. 2007
Firstpage
522
Lastpage
526
Abstract
Multi-layer lamination with carbon fugitive material to realize embedded channels in low shrinkage LTCC laminates was investigated. The sagging behaviors of suspended LTCC laminates over the cavity after lamination and co-firing were studied. Suspended LTCC laminates over the channels of width 1 to 10 mm were dimensionally stable after sintering with maximum deflection of less than 20 mum. Swelling (i.e. deflection in the opposite direction of sagging) was observed for suspended LTCC laminates over the channels of width 15 to 30 mm after co-firing. The LTCC material and carbon burnout behavior were characterized using thermal analysis techniques. Based on the thermal analyses, a multi-step burnout process was proposed to control the carbon burnout in realizing dimensionally stable embedded channels.
Keywords
ceramics; firing (materials); laminations; sintering; carbon burnout behavior; carbon fugitive material; dimensionally stable embedded channels; low shrinkage LTCC laminates; low shrinkage ceramics; low temperature co-fired ceramic; multilayer lamination; multistep burnout process; sagging behaviors; suspended LTCC laminates; Atmosphere; Ceramics; Glass; Laminates; Lamination; Manufacturing; Organic materials; Polymers; Size control; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location
Singapore
Print_ISBN
978-1-4244-1323-2
Electronic_ISBN
978-1-4244-1323-2
Type
conf
DOI
10.1109/EPTC.2007.4469734
Filename
4469734
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