Improved VCSEL structures for 10 gigabit-Ethernet and next generation optical-integrated PC-boards

Author

Mederer, F. ; Jager, R. ; Joos, J. ; Kicherer, M. ; King, R. ; Michalzik, R. ; Riedl, M. ; Unold, H. ; Ebeling, K.J. ; Lehmacher, S. ; Wittmann, B. ; Neyer, A.

Author_Institution

Dept. of Optoelectron., Ulm Univ., Germany

fYear

2001

fDate

2001

Firstpage

1

Lastpage

7

Abstract

We have investigated direct optical interconnection between processor ICs on chip-to-chip level using VCSELs and 2-D 17 cm long, 120 μm diameter step-index polymer optical fiber (POF) bundles. Their bandwidth-length-product of 2 GHz·m makes them well suited for low-cost high-speed parallel optical interconnects on a board level. We have demonstrated 10 Gbit/s PRBS NRZ data transmission over four channels of a POF array

Keywords

integrated optics; local area networks; optical interconnections; printed circuits; surface emitting lasers; 10 Gbit/s; Ethernet; PRBS NRZ data transmission; VCSEL; bandwidth-length product; high-speed parallel optical interconnect; optical integrated printed circuit board; processor IC; step-index polymer optical fiber array; Clocks; Data communication; Indium gallium arsenide; Integrated circuit interconnections; Optical fibers; Polymers; Temperature distribution; Thermal resistance; Threshold current; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2001. Proceedings., 51st

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-7038-4

Type

conf

DOI

10.1109/ECTC.2001.927657

Filename

927657