Ultra Compact LTCC Based AiP for 60 GHz Applications

Author

Wai, Lai L. ; Chua, Kai M. ; Lu, Albert C W ; Zhang, Y.P. ; Sun, M.

Author_Institution

Singapore Inst. of Manuf. Technol., Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

595

Lastpage

599

Abstract

In this paper we propose to integrate two antennas in an IC package that carries the 60-GHz radio chip sets. The antennas realized in this manner are simply called as AiP (antenna-in-package). AiP are radically different as compared with the integrated and chip antenna solutions. The AiP solution offers the possibility to combine antennas with a highly integrated 60-GHz radio into a compact standard surface mounted device. As a result, the system-level board space and the system-level manufacturing can be further reduced and facilitated, respectively.

Keywords

ball grid arrays; ceramics; chip scale packaging; firing (materials); low-temperature techniques; millimetre wave antenna arrays; radiocommunication; surface mount technology; system-in-package; IC package; antenna-in-package; antennas integration; ceramic ball grid array packages; frequency 60 GHz; low temperature co-fired ceramic technology; radio chip sets; standard surface mounted device; system-level board space manufacturing; system-level manufacturing; ultra compact LTCC; Bandwidth; Ceramics; Electronics packaging; Fabrication; Integrated circuit packaging; Manufacturing; Radio transmitters; Silicon; Streaming media; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469762

Filename

4469762