The Variation of Shear Strength of the Lead Free Sn/3.0Ag/0.5Cu Solder Balls

Author

Kuang, Jao-Hwa ; Hsu, Chao-Ming ; Chiu, Wen-Chun

Author_Institution

Nat. Sun Yat-Sen Univ., Kaohsiung

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

910

Lastpage

913

Abstract

The variations of shear loads with the deformation of lead free tin-sliver-copper (Sn/3.0Ag/0.5Cu) and traditional eutectic tin-lead (Sn/37Pb) solder balls are studied in this work. Two load speeds, i.e. 200 mum/s and 300 mum/s, are used to show the effect of loading speed on the shear strength variation. A shear strength based on the plastic energy is proposed to indicate the strength variation. The shear deformation of the loaded solder balls during the pull test are measured and compared. Experimental results indicate that the lead free Sn/3.0Ag/0.5Cu solder balls can provide much ductile joint than the traditional eutectic 63Sn/37Pb solder ball can.

Keywords

shear strength; solders; SnAgCu; SnPb; lead free tin-sliver-copper solder ball; plastic energy; shear deformation; shear load; shear strength variation; tin-lead solder ball; velocity 200 mum/s; velocity 300 mum/s; Electrical resistance measurement; Environmentally friendly manufacturing techniques; Force measurement; Lead; Packaging; Plastics; Pollution measurement; Soldering; Testing; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469770

Filename

4469770