Title :
Behavior of Lead Free Solder Joint after Thermal Treatment
Author :
Chotchakornpant, Sirarat ; Tippayamontri, Jinusda ; Kongsubto, Prong
Author_Institution :
Spansion (Thailand) Ltd., Nonthaburi
Abstract :
Thermal behaviors of the joint between solder and pad finish is studied. Two couples of solder alloy and pad finish used in this experiment included Sn98.3Ag1.2Cu0.5 on OSP pad and Sn96.5Ag3.0Cu0.5 on Ni/Au pad. Note that OSP stands for organic solderability preservatives and Ni/Au means Ni layer coated with a thin film of Au. The purpose of this paper is to investigate how the intermetallic compound (IMC) at solder joint changes with the increasing of the temperature. In addition, the relation of the intermetallic compound, solder alloy and joint strength was also analyzed.
Keywords :
ball grid arrays; copper alloys; gold; nickel; silver alloys; soldering; thermal management (packaging); tin alloys; Ni-Au; SnAgCu; ball grid array package; intermetallic compound; joint strength; lead free solder joint; organic solderability preservatives; pad finish; solder alloy; thermal treatment; Aging; Electronics packaging; Environmentally friendly manufacturing techniques; Gold; Intermetallic; Lead; Soldering; Substrates; Temperature; Testing;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469783
