DocumentCode :
3161815
Title :
Study on mobility of water and polymer chain in epoxy for microelectronic applications
Author :
Luo, Shijian ; Leisen, Johannes ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2001
fDate :
2001
Firstpage :
149
Lastpage :
154
Abstract :
This paper presents a study on mobility of water and polymer chain in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both 1H NMR and 2H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature of polymeric material. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water. The translational mobility of water within epoxies was studied by measuring the diffusion coefficient of water in epoxies through the water uptake. Higher rotational mobilities of water and polymer chains in the rubbery state lead to a significant increase of the water diffusion coefficient in the rubbery state polymer matrix as compared to a polymer in its glassy state
Keywords :
diffusion; glass transition; moisture; nuclear magnetic resonance; polymers; sorption; water; 1H NMR; 2H NMR; binding state; epoxy resin; glass transition temperature; glassy state; microelectronic material; moisture diffusion; plasticizing effect; polymer chain mobility; rubbery state; solid-state nuclear magnetic resonance; water absorption; water mobility; Glass; Hybrid integrated circuits; Materials science and technology; Microelectronics; Moisture; Nuclear magnetic resonance; Packaging; Polymers; Temperature; Topology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
ISSN :
0569-5503
Print_ISBN :
0-7803-7038-4
Type :
conf
DOI :
10.1109/ECTC.2001.927710
Filename :
927710
Link To Document :
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