Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages

Author

Kanth, K.R. ; Paghasian, K.Y. ; Retuta, D. ; Toh, Chin Hock ; Tanary, S. ; Tan Hian Boon

Author_Institution

United Test & Assembly Center Ltd, Singapore

fYear

2007

fDate

10-12 Dec. 2007

Firstpage

811

Lastpage

817

Abstract

This paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results.

Keywords

ball grid arrays; chip scale packaging; electromagnetic shielding; fine-pitch technology; flip-chip devices; integrated circuit design; integrated circuit interconnections; system-in-package; transfer moulding; IR shields; critical mold parameters; effective parameter optimization; flip chips packages; stacked die FBGA packages; system in package; tooling strategies; transfer moldable under-fill mold compounds; vacuum chase; Assembly systems; Costs; Design optimization; Electronics packaging; Flip chip; Laminates; Qualifications; Strips; System testing; Vacuum systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th

Conference_Location

Singapore

Print_ISBN

978-1-4244-1323-2

Electronic_ISBN

978-1-4244-1323-2

Type

conf

DOI

10.1109/EPTC.2007.4469790

Filename

4469790