A tri-band bandpass filter using 2T4L2C-pattern multi-layer structure

Author

Hsiao, Pai-Yi ; Weng, Ro-Min

Author_Institution

Dept. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan

fYear

2009

fDate

7-10 Dec. 2009

Firstpage

1416

Lastpage

1418

Abstract

This paper presents a tri-band bandpass filter (BPF) based on a multi-layer technology. A tri-layer structure is adopted for both a compact size and a high coupling effect. The proposed tri-band BPF consists of three layers which are two T-shaped transmission lines on the top layer, four symmetrical L-shaped resonators on the middle layer, and two back-to-back C-shaped open-loop resonators defected-ground structures on the bottom layer. The first and the second passbands of BPF are realized by the defected ground structure. The third passband is generated using four L-shape resonators. The substrate material for fabrication is an FR4 PCB with a dielectric constant of 4.4 and a thickness of 0.8mm. The proposed tri-band BPF can be operated at 1.5GHz, 3.5GHz, and 5.8GHz.

Keywords

UHF filters; band-pass filters; microwave filters; printed circuits; resonators; transmission lines; 2T4L2C-pattern multilayer structure; FR4 PCB; T-shaped transmission lines; back-to-back C-shaped open-loop resonators; defected-ground structures; dielectric constant; frequency 1.5 GHz; frequency 3.5 GHz; frequency 5.8 GHz; size 0.8 mm; substrate material; symmetrical L-shaped resonators; triband bandpass filter; Band pass filters; Circuit simulation; Dielectric constant; Dielectric substrates; Filtering theory; Frequency; Microwave filters; Passband; Resonator filters; Wireless LAN; Tri-band; defected ground structure; multi-layer; open-loop;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2009. APMC 2009. Asia Pacific

Conference_Location

Singapore

Print_ISBN

978-1-4244-2801-4

Electronic_ISBN

978-1-4244-2802-1

Type

conf

DOI

10.1109/APMC.2009.5384115

Filename

5384115