Title :
Recent Advancement in Characterization, Modeling and Correlation for Power Distribution Network of FPGA and Structural ASIC Packages and Devices
Author :
Shi, Hong ; Low, Hoon Ngik ; Yew, Yeehuan
Author_Institution :
Altera Corp., San Jose
Abstract :
This paper discusses recent progress made in power distribution network (PDN) characterization, modeling and hardware-to-model correlation in Altera. A complete methodology and process are introduced for accurate PDN measurement and associated equivalent RLC parameter extraction. The proposed method is validated through modeling and measurement correlation and believed to be beneficial to system users in FPGA and ASIC field.
Keywords :
RLC circuits; application specific integrated circuits; equivalent circuits; field programmable gate arrays; integrated circuit design; integrated circuit modelling; integrated circuit packaging; Altera; FPGA; PDN characterization; equivalent RLC parameter extraction; hardware-to-model correlation; power distribution network; structural ASIC packages; Application specific integrated circuits; Equivalent circuits; Field programmable gate arrays; Impedance measurement; Inductance; Packaging; Power system modeling; Power systems; Testing; Voltage;
Conference_Titel :
Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-1323-2
Electronic_ISBN :
978-1-4244-1323-2
DOI :
10.1109/EPTC.2007.4469802
