Title :
Design method for high reliable flip chip BGA package
Author :
Saito, Naoto ; Yamada, Osamu ; Ono, Takayuki ; Uda, Takayuki
Author_Institution :
Mech. Eng. Res. Lab., Hitachi Ltd., Tsuchiura, Japan
Abstract :
An efficient design method for flip chip ball grid array (BGA) packages has been developed. This method uses design of experiment (DOE), a series of finite element (FE) stress analyses based on an orthogonal array used in DOE, and statistical analysis. By using this method to design a BGA package having 1600 pins, the warpage of the optimum packaging structure is very small and all of the reliability demands are satisfied
Keywords :
ball grid arrays; design of experiments; finite element analysis; flip-chip devices; reliability; statistical analysis; stress analysis; design methodology; design of experiments; finite element stress analysis; flip-chip ball grid array package; orthogonal array; reliability; statistical analysis; Delamination; Design methodology; Electronics packaging; Flip chip; Laboratories; Large scale integration; Resins; Silicon; Tensile stress; US Department of Energy;
Conference_Titel :
Electronic Components and Technology Conference, 2001. Proceedings., 51st
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-7038-4
DOI :
10.1109/ECTC.2001.927734
