• DocumentCode
    3162333
  • Title

    Acid texturing of large area multi-crystalline silicon wafers for solar cell fabrication

  • Author

    Su Zhou ; Chunlan Zhou ; Wenjing Wang ; Yehua Tang ; Jingwei Chen ; Baojun Yan ; Yan Zhao

  • Author_Institution
    Key Lab. of Solar Thermal Energy & Photovoltaic Syst., Inst. of Electr. Eng., Beijing, China
  • Volume
    1
  • fYear
    2014
  • fDate
    19-21 Aug. 2014
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    Surface texturing of silicon can improve the incident light trapping and hence increase the conversion efficiency of solar cells. The texturing of multi-crystalline silicon (mc-Si) for solar cells with HF/HNO3 acidic solution has been investigated in this work. The recipe of texturing solution was studied to eliminate grain boundaries and defects which may appear in the texturing process. The effect of etch depth on large size solar cell process was also discussed. It is suggested that appropriate etch depth may enhance the surface quality of solar cells without negative effect on the incident light trapping. The result shows that elimination of deep grain boundaries and defects and enhancement of surface quality improves cell performance by increasing the open circuit voltage and the short circuit current.
  • Keywords
    grain boundaries; short-circuit currents; silicon; solar cells; HF-HNO3; Si; acid texturing; acidic solution; cell performance; deep grain boundaries; etch depth; grain boundaries; incident light trapping; large area multi-crystalline silicon wafers; multicrystalline silicon; open circuit voltage; short circuit current; solar cell fabrication; solar cell process; solar cells; surface quality; surface quality enhancement; surface texturing; texturing; texturing process; Etching; Photovoltaic cells; Reflectivity; Silicon; Surface morphology; Surface texture; Acid; Multi-crystalline silicon; Solar cell; Texturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Renewable Energy and Environment (ICMREE), 2013 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-3335-8
  • Type

    conf

  • DOI
    10.1109/ICMREE.2013.6893608
  • Filename
    6893608