DocumentCode
3162376
Title
A novel fractal PCB power plane for power integrity in high speed mixed signal system
Author
Huang, HuiFen ; Chu, QingXin ; Xie, ZeMing ; Xiao, JianKang
Author_Institution
Sch. of Electron. & Inf. Eng., South China Univ. of Technol., Guangzhou, China
fYear
2009
fDate
7-10 Dec. 2009
Firstpage
661
Lastpage
664
Abstract
In this paper, a novel fractal PCB power plane based on leaf vein fractal structure is developed. The technique introduced here not only provide noise suppression over a wide range of frequencies, but also improve IR drop and Swiss Chess structure effect (high resistance metal areas because of distributed vias and solders and leading to the voltages or currents to the circuit - elements lower than design demand).
Keywords
fractals; integrated circuit design; microwave integrated circuits; mixed analogue-digital integrated circuits; printed circuit design; IR drop; Swiss Chess structure; distributed vias; fractal PCB power plane; high speed mixed signal system; leaf vein fractal structure; power integrity; solders; Animal structures; Circuit noise; Fractals; Frequency; Lead; Metamaterials; Periodic structures; Power engineering and energy; Veins; Voltage; IR drop; SSN; Swiss Chess structure effect; fractal; power integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2009. APMC 2009. Asia Pacific
Conference_Location
Singapore
Print_ISBN
978-1-4244-2801-4
Electronic_ISBN
978-1-4244-2802-1
Type
conf
DOI
10.1109/APMC.2009.5384132
Filename
5384132
Link To Document